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| Datasheet File OCR Text: |
| SMTBJ SiBODTM series FEATURES 2.16 2.74 2.16 G Bi-directional transient voltage protection G Glass passivated junction G Nano second clamping response G Surge capability up to 250 (Amps) G No performance degradation under service life G Industry standard DO-2144AA Jedec outline G Available on tape (12mm) G UL recognised Solder Pads 2.26 All dimensions in mm MECHANICAL CHARACTERISTICS G Transfer molded, void free epoxy body G Terminals: modified `J' bend for large contact area G Tin/Lead plated leads G Maximum case temperature for soldering purposes: 230C for 10 seconds G Standard packaging: 12mm tape (meets EIA 481-1) G Device marking, device code, logo 2.0 B A 5.21/5.59 4.06/4.57 .102 .203 0.76/1.27 3.30/3.94 2.18/2.44 SEATING PLANE w w w. l i t t e l f u s e . c o m 59 SMTBJ SiBODTM series ELECTRICAL CHARACTERISTICS @ 25C Tamb SYMBOL VRM VBR VBO VT PARAMETER Stand-off voltage Breakdown voltage Breakover voltage On-state voltage IRM IBO IH Stand-off current Breakover current Holding current ABSOLUTE RATINGS SYMBOL Ipp Itsm di/dt T stg Tj TL Maximum temperature for soldering (For period of 10 seconds max) PARAMETER Peak Pulse Current Non-repetitive surge peak on-state current Critical rate of rise of on-state current Storage and operating junction temperature range 10/1000 sec 8-20 s expo tp20 ms Non-repetitive VALUE Type A Type B 50 100 150 250 30 100 -40 to +150 150 230 A A A A/s C C C Device Type SMTBJ050 A or B SMTBJ070 A or B SMTBJ100 A or B SMTBJ120 A or B SMTBJ170 A or B SMTBJ200 A or B Vrm Irm @ Vrm (A) 1 1 1 1 1 1 Vbr MIN 60 80 110 140 180 220 Vbo MAX 80 120 135 165 215 265 Vt TYP @ 1A <2V <2V <2V <2V <2V <2V Ibo TYP (mA) 50 50 50 50 50 50 Ih MIN (mA) 150 150 150 150 150 150 50 70 100 120 170 200 All parameters are tested using Fet TestTM Model 3600. 60 w w w. l i t t e l f u s e . c o m |
Price & Availability of SMTBJ070B
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